npn silicon phototransistor led lamps pb lead-free parts a LPT2041-PF 26 - mar. ligitek electronics co.,ltd. property of ligitek only data sheet doc. no : qw0905- rev. : date : - 2007 LPT2041-PF
v v (br)eco emitter-collector breakdown voltage on state collector current collector dark current collector-emitter saturation voltage fall time rise time i ceo ip(on) v ce(sat) tf tr v ce =30v ic=800 O O s v ic=0.5ma ee=20mw/c O ?? ? ? ? ?? ??????????????? O ?????????????????????????????????? ??? ?? ??? ????? ? s 100 1.emitter 2.collector i e =100 O ?? ? ?? ?????? ????????????????? ???? ?? ?? ??? ???? ???????????????????? ?????
part no. LPT2041-PF page 2/3 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only 150 time(sec) 260 c3sec max 260 ' temp( c) 2 /sec max 100 50 preheat 120 ' 25 ' 0 0 ' note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 5 /sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 60 seconds max
page3/3 LPT2041-PF ligitek electronics co.,ltd. property of ligitek only mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) test condition 1.ta=85 " 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=65 " 5 2.rh=90%~95% 3.t=240hrs % 2hrs 1.ta=-40 " 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 $% 5 $ &-40 $% 5 $ (10min) (10min) 2.total 10 cycles this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. description the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. reference standard part no. test item reliability test: operating life test low temperature storage test high temperature storage test thermal shock test high temperature high humidity test mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.t.sol=230 $% 5 $ 2.dwell time=5 % 1sec 1.t.sol=260 $% 5 $ 2.dwell time= 10 % 1sec. this test intended to see soldering well performed or not. solder resistance test solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
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